Inventor

BROEKAART MARCEL

FR38 patents

⚠️ This page may combine multiple inventors who share the name “BROEKAART MARCEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BROEKAART MARCEL

SOITEC SILICON ON INSULATOR

Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device

Hybrid structure for a surface acoustic wave device

Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device

Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device

Process for transferring circuit layer

Apparatus for manufacturing semiconductor devices

Hybrid structure for a surface acoustic wave device

Method for manufacturing a substrate

Method of mechanical separation for a double layer transfer

Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device

Method for manufacturing a substrate

Method of mechanical separation for a double layer transfer

Method for manufacturing a substrate

Method of mechanical separation for a double layer transfer

Support for a semiconductor structure

Process for the manufacture of a semiconductor element comprising a layer for trapping charges

Process for producing a receiver substrate for a semiconductor-on-insulator structure for radiofrequency applications and process for producing such a structure

Method for transferring a thin layer onto a support substrate provided with a charge-trapping layer

Process for transferring layers

Method for molecular adhesion bonding at low pressure

Method of thinning a structure

Method for manufacturing a semiconductor-on-insulator substrate

Method for locating devices

Method for producing composite structure with metal/metal bonding

Method for minimizing distortion of a signal in a radiofrequency circuit

Method for manufacturing a semiconductor on insulator type structure by layer transfer

Method for bonding by means of molecular adhesion

Method of fabrication of a semiconductor element comprising a highly resistive substrate

BROEKAART MARCEL

Direct bonding method with reduction in overlay misalignment

Progressive trimming method

System and method for assessing inhomogeneous deformations in multilayer plates

Method for molecular adhesion bonding at low pressure

Process for assembling wafers by means of molecular adhesion

CASTEX ARNAUD

Surface treatment for molecular bonding

Method and apparatus for bonding together two wafers by molecular adhesion

Method of initiating molecular bonding

Method of fabricating a multilayer structure with circuit layer transfer

LAGAHE BLANCHARD CHRYSTELLE

Method of bonding by molecular bonding