Inventor

TSENG MING-HONG

TW4 patents

⚠️ This page may combine multiple inventors who share the name “TSENG MING-HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSENG MING-HONG

2 patents

US8390125B2Mar 5, 2013

Through-silicon via formed with a post passivation interconnect structure

TSENG MING-HONG39 citations87

US8097953B2Jan 17, 2012

Three-dimensional integrated circuit stacking-joint interface structure

TSENG MING-HONG8 citations82

TAIWAN SEMICONDUCTOR MFG

1 patent

US7932608B2Apr 26, 2011

Through-silicon via formed with a post passivation interconnect structure

TAIWAN SEMICONDUCTOR MFG52 citations92

CHING KAI-MING

1 patent

US8624360B2Jan 7, 2014

Cooling channels in 3DIC stacks

CHING KAI-MING6 citations81