Inventor
CHEN WILLIAM T
TW22 patents
⚠️ This page may combine multiple inventors who share the name “CHEN WILLIAM T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS6358627B2Mar 19, 2002
Rolling ball connector
IBM164 citations99
US6177729B1Jan 23, 2001
Rolling ball connector
IBM84 citations98
US6258627B1Jul 10, 2001
Underfill preform interposer for joining chip to substrate
IBM69 citations96
US5442144AAug 15, 1995
Multilayered circuit board
IBM25 citations92
US5359767ANov 1, 1994
Method of making multilayered circuit board
IBM24 citations92
US6829149B1Dec 7, 2004
Placement of sacrificial solder balls underneath the PBGA substrate
IBM17 citations91
US5959348ASep 28, 1999
Construction of PBGA substrate for flip chip packing
IBM25 citations91
US4906803AMar 6, 1990
Flexible supporting cable for an electronic device and method of making same
IBM39 citations87
US6353182B1Mar 5, 2002
Proper choice of the encapsulant volumetric CTE for different PGBA substrates
IBM14 citations83
US6255599B1Jul 3, 2001
Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamination
IBM12 citations72
US5773132AJun 30, 1998
Protecting copper dielectric interface from delamination
IBM13 citations72
US7227268B2Jun 5, 2007
Placement of sacrificial solder balls underneath the PBGA substrate
IBM3 citations61
ADVANCED SEMICONDUCTOR ENG
5 patentsUS10276382B2Apr 30, 2019
Semiconductor device packages and stacked package assemblies including high density interconnections
ADVANCED SEMICONDUCTOR ENG27 citations93
US10886263B2Jan 5, 2021
Stacked semiconductor package assemblies including double sided redistribution layers
ADVANCED SEMICONDUCTOR ENG9 citations85
US10535521B2Jan 14, 2020
Semiconductor device packages and stacked package assemblies including high density interconnections
ADVANCED SEMICONDUCTOR ENG6 citations83
US10515806B2Dec 24, 2019
Semiconductor device packages and stacked package assemblies including high density interconnections
ADVANCED SEMICONDUCTOR ENG5 citations83
US10916429B2Feb 9, 2021
Semiconductor device packages and stacked package assemblies including high density interconnections
ADVANCED SEMICONDUCTOR ENG1 citations72