Inventor
CHOI GYUJIN
KR9 patents
Patents
9 patentsUS11990439B2May 21, 2024
Semiconductor package including under bump metallization pad
SAMSUNG ELECTRONICS CO LTD4 citations70
US11373955B2Jun 28, 2022
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations69
US11961812B2Apr 16, 2024
Semiconductor packages having vias
SAMSUNG ELECTRONICS CO LTD0 citations59
US11810864B2Nov 7, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11587898B2Feb 21, 2023
Semiconductor packages having vias
SAMSUNG ELECTRONICS CO LTD0 citations59
US11264339B2Mar 1, 2022
Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations55
US11978696B2May 7, 2024
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD0 citations49
US12489060B2Dec 2, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations48
US11972966B2Apr 30, 2024
Method of manufacturing a semiconductor package including correcting alignment error while forming redistribution wiring struture
SAMSUNG ELECTRONICS CO LTD0 citations48