Inventor
ANDERSON FELIX P
US15 patents
⚠️ This page may combine multiple inventors who share the name “ANDERSON FELIX P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ANDERSON FELIX P
7 patentsUS8604898B2Dec 10, 2013
Vertical integrated circuit switches, design structure and methods of fabricating same
ANDERSON FELIX P23 citations92
US8569091B2Oct 29, 2013
Integrated circuit switches, design structure and methods of fabricating the same
ANDERSON FELIX P6 citations83
US8921975B2Dec 30, 2014
System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme
ANDERSON FELIX P8 citations82
US8535966B2Sep 17, 2013
Horizontal coplanar switches and methods of manufacture
ANDERSON FELIX P3 citations62
US8518817B2Aug 27, 2013
Method of electrolytic plating and semiconductor device fabrication
ANDERSON FELIX P3 citations62
US8293634B2Oct 23, 2012
Structures and methods for improving solder bump connections in semiconductor devices
ANDERSON FELIX P1 citations51
US8969195B2Mar 3, 2015
Methods of manufacturing semiconductor devices and a semiconductor structure
ANDERSON FELIX P0 citations50
IBM
5 patentsUS8791778B2Jul 29, 2014
Vertical integrated circuit switches, design structure and methods of fabricating same
IBM14 citations84
US7833907B2Nov 16, 2010
CMP methods avoiding edge erosion and related wafer
IBM12 citations83
US8878315B2Nov 4, 2014
Horizontal coplanar switches and methods of manufacture
IBM0 citations52
US9284185B2Mar 15, 2016
Integrated circuit switches, design structure and methods of fabricating the same
IBM0 citations51
US8927411B2Jan 6, 2015
System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme
IBM1 citations51
GLOBALFOUNDRIES INC
2 patentsUS9673091B2Jun 6, 2017
Structure for BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion
GLOBALFOUNDRIES INC2 citations67
US10163697B2Dec 25, 2018
Method for forming BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion
GLOBALFOUNDRIES INC0 citations46