Inventor

LIU CHENG-CHENG

TW4 patents

⚠️ This page may combine multiple inventors who share the name “LIU CHENG-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

2 patents

US7081678B2Jul 25, 2006

Multi-chip package combining wire-bonding and flip-chip configuration

ADVANCED SEMICONDUCTOR ENG69 citations92

US7763959B2Jul 27, 2010

Heat slug for package structure

ADVANCED SEMICONDUCTOR ENG2 citations59

ACCTON TECHNOLOGY CORP

1 patent

US6816030B2Nov 9, 2004

Impedance matching circuit for rejecting an image signal via a microstrip structure

ACCTON TECHNOLOGY CORP2 citations60

LIU JUN-CHENG

1 patent

US8800638B2Aug 12, 2014

Heatsink and heatsink-positioning system

LIU JUN-CHENG0 citations39