Inventor

LEE YEE KIM

MY4 patents

⚠️ This page may combine multiple inventors who share the name “LEE YEE KIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LI FELIX C

2 patents

US8097934B1Jan 17, 2012

Delamination resistant device package having low moisture sensitivity

LI FELIX C16 citations89

US8736042B2May 27, 2014

Delamination resistant device package having raised bond surface and mold locking aperture

LI FELIX C2 citations59

NAT SEMICONDUCTOR CORP

1 patent

US7838980B1Nov 23, 2010

TO263 device package having low moisture sensitivity

NAT SEMICONDUCTOR CORP14 citations82

LEE SHAW WEI

1 patent

US8093707B2Jan 10, 2012

Leadframe packages having enhanced ground-bond reliability

LEE SHAW WEI1 citations39