Inventor
PARK HYUNGSANG
KR12 patents
⚠️ This page may combine multiple inventors who share the name “PARK HYUNGSANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PARK HYUNGSANG
3 patentsUS8569869B2Oct 29, 2013
Integrated circuit packaging system with encapsulation and method of manufacture thereof
PARK HYUNGSANG7 citations81
US8102666B2Jan 24, 2012
Integrated circuit package system
PARK HYUNGSANG3 citations60
US8592973B2Nov 26, 2013
Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof
PARK HYUNGSANG1 citations50
STATS CHIPPAC LTD
2 patentsUS9837484B2Dec 5, 2017
Semiconductor device and method of forming substrate including embedded component with symmetrical structure
STATS CHIPPAC LTD31 citations93
US7859099B2Dec 28, 2010
Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
STATS CHIPPAC LTD6 citations72
STATS CHIPPAC PTE LTD
2 patentsUS10236337B2Mar 19, 2019
Semiconductor device and method of forming substrate including embedded component with symmetrical structure
STATS CHIPPAC PTE LTD2 citations72
US10665662B2May 26, 2020
Semiconductor device and method of forming substrate including embedded component with symmetrical structure
STATS CHIPPAC PTE LTD0 citations51