Inventor
CHOI A LEAM
KR11 patents
⚠️ This page may combine multiple inventors who share the name “CHOI A LEAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHOI A LEAM
6 patentsUS8080446B2Dec 20, 2011
Integrated circuit packaging system with interposer interconnections and method of manufacture thereof
CHOI A LEAM4 citations61
US8183089B2May 22, 2012
Method for manufacturing package system incorporating flip-chip assembly
CHOI A LEAM3 citations60
US8970044B2Mar 3, 2015
Integrated circuit packaging system with vertical interconnects and method of manufacture thereof
CHOI A LEAM1 citations50
US8699232B2Apr 15, 2014
Integrated circuit packaging system with interposer and method of manufacture thereof
CHOI A LEAM1 citations50
US8558366B2Oct 15, 2013
Integrated circuit packaging system with interposer interconnections and method of manufacture thereof
CHOI A LEAM1 citations50
US8093100B2Jan 10, 2012
Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
CHOI A LEAM0 citations50
STATS CHIPPAC LTD
3 patentsUS7859120B2Dec 28, 2010
Package system incorporating a flip-chip assembly
STATS CHIPPAC LTD11 citations83
US7859099B2Dec 28, 2010
Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
STATS CHIPPAC LTD6 citations72
US8008787B2Aug 30, 2011
Integrated circuit package system with delamination prevention structure
STATS CHIPPAC LTD2 citations59