P

Inventor

LEE CHANG CHI

TW45 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHANG CHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

28 patents
US6528882B2Mar 4, 2003

Thermal enhanced ball grid array package

ADVANCED SEMICONDUCTOR ENG151 citations98
US8035213B2Oct 11, 2011

Chip package structure and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG124 citations94
US10134677B1Nov 20, 2018

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG20 citations93
US6403896B1Jun 11, 2002

Substrate having specific pad distribution

ADVANCED SEMICONDUCTOR ENG19 citations91
US11127650B2Sep 21, 2021

Semiconductor device package including thermal dissipation element and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG8 citations83
US10037974B2Jul 31, 2018

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG10 citations81
US9589840B2Mar 7, 2017

Semiconductor package and manufacturing method thereof

ADVANCED SEMICONDUCTOR ENG4 citations73
US9917043B2Mar 13, 2018

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG2 citations72
US11594518B2Feb 28, 2023

Semiconductor package

ADVANCED SEMICONDUCTOR ENG2 citations71
US12132006B2Oct 29, 2024

Semiconductor package structure

ADVANCED SEMICONDUCTOR ENG0 citations62
US12581955B2Mar 17, 2026

Electronic devices comprising voltage regulator and electromagnetic interference (EMI) shielding structure transmitting voltages

ADVANCED SEMICONDUCTOR ENG0 citations61
US12406921B2Sep 2, 2025

Electronic device

ADVANCED SEMICONDUCTOR ENG0 citations61
US12213247B2Jan 28, 2025

Electronic device

ADVANCED SEMICONDUCTOR ENG0 citations61
US12107074B2Oct 1, 2024

Semiconductor package including processing element and I/O element

ADVANCED SEMICONDUCTOR ENG0 citations61
US11967559B2Apr 23, 2024

Electronic package

ADVANCED SEMICONDUCTOR ENG0 citations61
US8022534B2Sep 20, 2011

Semiconductor package using an active type heat-spreading element

ADVANCED SEMICONDUCTOR ENG6 citations60
US12347811B2Jul 1, 2025

Electronic device including electronic component receiving power from two sides

ADVANCED SEMICONDUCTOR ENG0 citations59
US12156336B2Nov 26, 2024

Electronic device

ADVANCED SEMICONDUCTOR ENG0 citations59
US12532408B2Jan 20, 2026

Electronic device and package structure

ADVANCED SEMICONDUCTOR ENG0 citations54
US12564078B2Feb 24, 2026

Electronic package

ADVANCED SEMICONDUCTOR ENG0 citations52
US12176305B2Dec 24, 2024

Semiconductor package with integrated voltage regulator device and separate bridge die

ADVANCED SEMICONDUCTOR ENG0 citations52
US10056325B2Aug 21, 2018

Semiconductor package having a trench penetrating a main body

ADVANCED SEMICONDUCTOR ENG0 citations52
US12381150B2Aug 5, 2025

Electronic device

ADVANCED SEMICONDUCTOR ENG0 citations51
US10541198B2Jan 21, 2020

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations51
US9741675B2Aug 22, 2017

Bump structures, semiconductor device and semiconductor device package having the same

ADVANCED SEMICONDUCTOR ENG0 citations51
US11991827B2May 21, 2024

Electronic device

ADVANCED SEMICONDUCTOR ENG0 citations48
US12517299B2Jan 6, 2026

Optoelectronic device and method of transmitting optical signal

ADVANCED SEMICONDUCTOR ENG0 citations46
US7222124B2May 22, 2007

Internet automatic electric data system

ADVANCED SEMICONDUCTOR ENG1 citations45

RICH ELECTRIC WIRE AND CABLE CO LTD

5 patents

LEE CHANG-CHI

2 patents

ASIA VITAL COMPONENTS CO LTD

1 patent

UNIV NAT YUNLIN SCI & TECH

1 patent

RICH ELECTRIC WIRE & CABLE CO

1 patent

SHIH MENG-KAI

1 patent

JIN HSIN HO MOLD ENTPR CO LTD

1 patent

TAI SHINY TECH CO LTD

1 patent

(unassigned)

1 patent

CHOU JUNG-CHUAN

1 patent

LEE CHANG CHI

1 patent

NEXXT ALLOY IND CO LTD

1 patent