Inventor

DI XIAOFENG

CN4 patents

⚠️ This page may combine multiple inventors who share the name “DI XIAOFENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SANDISK SEMICONDUCTOR SHANGHAI CO LTD

2 patents

US10483239B2Nov 19, 2019

Semiconductor device including dual pad wire bond interconnection

SANDISK SEMICONDUCTOR SHANGHAI CO LTD5 citations64

US10283485B2May 7, 2019

Semiconductor device including conductive bump interconnections

SANDISK SEMICONDUCTOR SHANGHAI CO LTD0 citations45

WESTERN DIGITAL TECH INC

2 patents

US11749647B2Sep 5, 2023

Semiconductor device including vertical wire bonds

WESTERN DIGITAL TECH INC0 citations56

US11901327B2Feb 13, 2024

Wire bonding for semiconductor devices

WESTERN DIGITAL TECH INC0 citations55