Inventor
YANG DANFENG
CN9 patents
⚠️ This page may combine multiple inventors who share the name “YANG DANFENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
JCET GROUP CO LTD
8 patentsUS12482765B2Nov 25, 2025
Packaging structure and manufacturing method thereof
JCET GROUP CO LTD0 citations59
US12593731B2Mar 31, 2026
Packaging structure and manufacturing method thereof
JCET GROUP CO LTD0 citations58
US12581965B2Mar 17, 2026
Packaging structure and manufacturing method thereof
JCET GROUP CO LTD0 citations58
US12148681B2Nov 19, 2024
Fan-out package structure and method for manufacturing the same
JCET GROUP CO LTD0 citations57
US12500329B2Dec 16, 2025
Antenna packaging structure and manufacturing method thereof
JCET GROUP CO LTD0 citations50
US12550261B2Feb 10, 2026
Package structure with inductor, and manufacturing method thereof
JCET GROUP CO LTD0 citations49
US12249582B2Mar 11, 2025
SIP package structure
JCET GROUP CO LTD0 citations48
US11854949B2Dec 26, 2023
Package structure having a plurality of chips attached to a lead frame by redistribution layer
JCET GROUP CO LTD0 citations48