Inventor · disambiguated record
Wenbo Shao
Also filed as: SHAO WENBO
6 granted patents·1 pending application·1 citations·filing 2011–2025
67Inventor score
Top patents by PatentIndex Score
7 records- 0173US12157944B2Method and wet chemical compositions for diffusion barrier formationMACDERMID ENTHONE INC·Filed 2023·Granted Dec 3, 2024·0 cites·37 claims
- 0268US2025243596A1Composition and Method for Fabrication of Nickel InterconnectsMACDERMID ENTHONE INC·Filed 2025·Application pending·0 cites
- 0366US11846018B2Method and wet chemical compositions for diffusion barrier formationMACDERMID ENTHONE INC·Filed 2022·Granted Dec 19, 2023·0 cites·9 claims
- 0463US10103029B2Process for filling vias in the microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted Oct 16, 2018·1 cites·27 claims
- 0557US12270121B2Composition and method for fabrication of nickel interconnectsMACDERMID ENTHONE INC·Filed 2020·Granted Apr 8, 2025·0 cites·19 claims
- 0640US10541140B2Process for filling vias in the microelectronicsRICHARDSON THOMAS B·Filed 2012·Granted Jan 21, 2020·0 cites·24 claims
- 0733US10221496B2Copper filling of through silicon viasRICHARDSON THOMAS B·Filed 2011·Granted Mar 5, 2019·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →