Inventor
WOO KUAN YEE
MY3 patents
Patents
3 patentsUS8203199B2Jun 19, 2012
Tie bar and mold cavity bar arrangements for multiple leadframe stack package
LEE LEE HAN MENG EUGENE6 citations67
US8779566B2Jul 15, 2014
Flexible routing for high current module application
LEE LEE HAN MENG EUGENE2 citations57
US8304887B2Nov 6, 2012
Module package with embedded substrate and leadframe
LEE LEE HAN MENG EUGENE1 citations46