Inventor

SHIN JOON-SIK

KR7 patents

⚠️ This page may combine multiple inventors who share the name “SHIN JOON-SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIN JOON-SIK

2 patents

US8647926B2Feb 11, 2014

Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip

SHIN JOON-SIK4 citations68

US9457055B2Oct 4, 2016

Method for treating inflammation, arthritis or disc diseases using a mixed extract of cibotii rhizoma, ledebouriellae radix, achyranthis radix, paeonia lactiflora pall and glycyrrhizae radix

SHIN JOON-SIK1 citations48

SOHN KEUNG-JIN

2 patents

US8397378B2Mar 19, 2013

Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board

SOHN KEUNG-JIN2 citations56

US8450618B2May 28, 2013

Printed circuit board with reinforced thermoplastic resin layer

SOHN KEUNG-JIN0 citations46

SAMSUNG ELECTRO MECH

1 patent

US7893527B2Feb 22, 2011

Semiconductor plastic package and fabricating method thereof

SAMSUNG ELECTRO MECH14 citations82

PARK JUNG-HWAN

1 patent

US8499441B2Aug 6, 2013

Method of manufacturing a printed circuit board

PARK JUNG-HWAN2 citations60

SOHN KEUNGJIN

1 patent

US8997340B2Apr 7, 2015

Method of manufacturing and insulating sheet

SOHN KEUNGJIN1 citations44