Inventor
ARELLANO FREDERICK
PH5 patents
Patents
5 patentsUS9824979B2Nov 21, 2017
Electronic package having electromagnetic interference shielding and associated method
ST MICROELECTRONICS INC4 citations66
US12543575B2Feb 3, 2026
Bottom package exposed die MEMS pressure sensor integrated circuit package design
ST MICROELECTRONICS INC0 citations59
US11355423B2Jun 7, 2022
Bottom package exposed die MEMS pressure sensor integrated circuit package design
ST MICROELECTRONICS INC0 citations59
US10483191B2Nov 19, 2019
Bottom package exposed die MEMS pressure sensor integrated circuit package design
ST MICROELECTRONICS INC0 citations48
US9761538B1Sep 12, 2017
Method for making a shielded integrated circuit (IC) package with an electrically conductive polymer layer
ST MICROELECTRONICS INC0 citations48