Inventor
WONG JIA YI
MY6 patents
⚠️ This page may combine multiple inventors who share the name “WONG JIA YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
4 patentsUS10727151B2Jul 28, 2020
Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package
INFINEON TECHNOLOGIES AG2 citations67
US11107754B2Aug 31, 2021
Electronic device, leadframe for an electronic device and method for fabricating an electronic device and a leadframe
INFINEON TECHNOLOGIES AG0 citations51
US11217529B2Jan 4, 2022
Semiconductor device and method of forming a semiconductor device
INFINEON TECHNOLOGIES AG0 citations47
US10431526B2Oct 1, 2019
Rivetless lead fastening for a semiconductor package
INFINEON TECHNOLOGIES AG0 citations34