Inventor
KWON YOUNGIK
TW5 patents
Patents
5 patentsUS11764161B2Sep 19, 2023
Ground connection for semiconductor device assembly
MICRON TECHNOLOGY INC2 citations70
US11515174B2Nov 29, 2022
Semiconductor devices with package-level compartmental shielding and associated systems and methods
MICRON TECHNOLOGY INC2 citations70
US11942455B2Mar 26, 2024
Stacked semiconductor dies for semiconductor device assemblies
MICRON TECHNOLOGY INC0 citations60
US11362071B2Jun 14, 2022
Stacked semiconductor dies for semiconductor device assemblies
MICRON TECHNOLOGY INC0 citations60
US11621245B2Apr 4, 2023
Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems
MICRON TECHNOLOGY INC0 citations49