Inventor
LIAO HSIN-HUNG
TW33 patents
⚠️ This page may combine multiple inventors who share the name “LIAO HSIN-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
26 patentsUS10157881B2Dec 18, 2018
Methods for controlling warpage in packaging
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10056285B2Aug 21, 2018
Semiconductor wafer device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9984960B2May 29, 2018
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations84
US9870997B2Jan 16, 2018
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9768142B2Sep 19, 2017
Mechanisms for forming bonding structures
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9484226B2Nov 1, 2016
Methods for controlling warpage in packaging
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10510712B2Dec 17, 2019
Methods for controlling warpage in packaging
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10276509B2Apr 30, 2019
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10269582B2Apr 23, 2019
Package structure, fan-out package structure and method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US9870929B2Jan 16, 2018
Package structure, fan-out package structure and method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US9812346B2Nov 7, 2017
Semiconductor wafer device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US9498851B2Nov 22, 2016
Methods for forming apparatus for stud bump formation
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US11721555B2Aug 8, 2023
Method and system for thinning wafer thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11532551B2Dec 20, 2022
Semiconductor package with chamfered semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11233032B2Jan 25, 2022
Mechanisms for forming bonding structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11139177B2Oct 5, 2021
Method of fabricating semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11101232B2Aug 24, 2021
Conductive micro pin
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11094561B2Aug 17, 2021
Semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10770331B2Sep 8, 2020
Semiconductor wafer device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10727074B2Jul 28, 2020
Method and system for thinning wafer thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10679866B2Jun 9, 2020
Interconnect structure for semiconductor package and method of fabricating the interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10504870B2Dec 10, 2019
Mechanisms for forming bonding structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10115690B2Oct 30, 2018
Method of manufacturing micro pins and isolated conductive micro pin
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9129899B2Sep 8, 2015
Method and system for thinning wafer thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10867890B2Dec 15, 2020
Mutli-chip package with encapsulated conductor via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10438922B2Oct 8, 2019
Method and system for mounting components in semiconductor fabrication process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41
TAIWAN SEMICONDUCTOR MFG
4 patentsUS9093337B2Jul 28, 2015
Methods for controlling warpage in packaging
TAIWAN SEMICONDUCTOR MFG27 citations92
US9236351B2Jan 12, 2016
Semiconductor wafer device
TAIWAN SEMICONDUCTOR MFG0 citations52
US9085049B2Jul 21, 2015
Method and system for manufacturing semiconductor device
TAIWAN SEMICONDUCTOR MFG0 citations52
US8936730B2Jan 20, 2015
Methods for forming apparatus for stud bump formation
TAIWAN SEMICONDUCTOR MFG0 citations52