Inventor
LIANG HSIAO-CHUNG
TW14 patents
⚠️ This page may combine multiple inventors who share the name “LIANG HSIAO-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS10157881B2Dec 18, 2018
Methods for controlling warpage in packaging
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9768142B2Sep 19, 2017
Mechanisms for forming bonding structures
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9659891B2May 23, 2017
Semiconductor device having a boundary structure, a package on package structure, and a method of making
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9484226B2Nov 1, 2016
Methods for controlling warpage in packaging
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11444002B2Sep 13, 2022
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10510712B2Dec 17, 2019
Methods for controlling warpage in packaging
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10276531B2Apr 30, 2019
Semiconductor device having a boundary structure, a package on package structure, and a method of making
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11749582B2Sep 5, 2023
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11233032B2Jan 25, 2022
Mechanisms for forming bonding structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10985135B2Apr 20, 2021
Methods for controlling warpage in packaging
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12463067B2Nov 4, 2025
Pickup apparatus and method of using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10804234B2Oct 13, 2020
Semiconductor device having a boundary structure, a package on package structure, and a method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10504870B2Dec 10, 2019
Mechanisms for forming bonding structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52