Inventor

EJIRI TAKAKO

JP4 patents

⚠️ This page may combine multiple inventors who share the name “EJIRI TAKAKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

1 patent

US7740936B2Jun 22, 2010

Adhesion assisting agent fitted metal foil, and printed wiring board using thereof

HITACHI CHEMICAL CO LTD11 citations81

TAKEUCHI MASAKI

1 patent

US8956732B2Feb 17, 2015

Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board

TAKEUCHI MASAKI3 citations60

EJIRI TAKAKO

1 patent

US8236906B2Aug 7, 2012

Polyamide-imide resin, process for production of polyamide resin, and curable resin composition

EJIRI TAKAKO3 citations54

SHOWA DENKO MATERIALS CO LTD

1 patent

US11905412B2Feb 20, 2024

Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package

SHOWA DENKO MATERIALS CO LTD0 citations53