Inventor
CHIANG YUAN-FENG
TW15 patents
Patents
15 patentsUS11837557B2Dec 5, 2023
Semiconductor device package and a method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations71
US11189576B2Nov 30, 2021
Semiconductor device package and a method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations71
US11037853B1Jun 15, 2021
Semiconductor package structure and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations69
US10211161B2Feb 19, 2019
Semiconductor package structure having a protection layer
ADVANCED SEMICONDUCTOR ENG3 citations63
US12532743B2Jan 20, 2026
Semiconductor device package and a method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations61
US11428946B2Aug 30, 2022
Method for manufacturing a through substrate via
ADVANCED SEMICONDUCTOR ENG0 citations61
US10663746B2May 26, 2020
Collimator, optical device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations61
US12272687B2Apr 8, 2025
Semiconductor device package with conductive pillars and reinforcing and encapsulating layers
ADVANCED SEMICONDUCTOR ENG0 citations59
US12107056B2Oct 1, 2024
Semiconductor device package and the method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations59
US11521958B2Dec 6, 2022
Semiconductor device package with conductive pillars and reinforcing and encapsulating layers
ADVANCED SEMICONDUCTOR ENG0 citations59
US11791227B2Oct 17, 2023
Electronic device package
ADVANCED SEMICONDUCTOR ENG0 citations57
US9929078B2Mar 27, 2018
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations51
US9947635B1Apr 17, 2018
Semiconductor package, interposer and semiconductor process for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations50
US10325854B2Jun 18, 2019
Interposer and semiconductor package device
ADVANCED SEMICONDUCTOR ENG0 citations49
US10344383B2Jul 9, 2019
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations44