Inventor

HUANG MIN LUNG

TW73 patents

⚠️ This page may combine multiple inventors who share the name “HUANG MIN LUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG MIN LUNG

ADVANCED SEMICONDUCTOR ENG

Semiconductor device having bump electrode

Chip structure

Chip packaging structure having redistribution layer with recess

Bump electrodes having multiple under ball metallurgy (UBM) layers

Solder bump structure and method for forming the same

Under bump metallization structure of a semiconductor wafer

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Solder ball fabricating process

Solder ball fabricating process

Bump fabrication process

Method of making wire connection in semiconductor device

Semiconductor device packages, redistribution structures, and manufacturing methods thereof

Interposer, semiconductor package structure, and semiconductor process

Interposer, semiconductor package structure, and semiconductor process

Semiconductor device having conductive via and manufacturing process

Method of enhancing the adhesion between photoresist layer and substrate and bumping process

Under bump metallurgic layer

Bumping process

Wafer bumping process

Process for fabricating wafer bumps

Bump manufacturing method

Lead-free bump fabrication process

Method of forming bumps

Bump manufacturing method

Method of forming bumps

Solder ball attaching process

Solder ball fabrication process

Bump fabrication method

Wiring structure and method of manufacturing the same

Method for making UBM pads and bumps on wafer

Package device, semiconductor device, and method for manufacturing the package device

Wiring structure and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Method for forming a redistribution layer in a wafer structure

Screen printing method of forming conductive bumps

Chip scale package with micro antenna and method for manufacturing the same

Method for mounting passive components on wafer

Redistribution layer of wafer and the fabricating method thereof

Wafer-level package structure

Bump fabrication process

Structure for preventing burnt fuse pad from further electrical connection

Method of forming bump

Method for preventing burnt fuse pad from further electrical connection

Bump fabrication process

Bump manufacturing method

HSIEH CHUEHAN

Semiconductor device package with an alignment mark

HUANG MIN-LUNG

Three-dimensional package and method of making the same