Inventor
LI CHRIS KEH-YEUAN
US2 patents
Patents
2 patentsUS11401441B2Aug 2, 2022
Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications
VERSUM MAT US LLC4 citations66
US11718767B2Aug 8, 2023
Chemical mechanical planarization composition for polishing oxide materials and method of use thereof
VERSUM MAT US LLC1 citations56