Inventor
KO YEOCHAN
KR4 patents
Patents
4 patentsUS10636765B2Apr 28, 2020
System-in-package with double-sided molding
STATS CHIPPAC PTE LTD24 citations93
US10797024B2Oct 6, 2020
System-in-package with double-sided molding
STATS CHIPPAC PTE LTD6 citations83
US9859200B2Jan 2, 2018
Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof
STATS CHIPPAC PTE LTD8 citations81
US11670618B2Jun 6, 2023
System-in-package with double-sided molding
STATS CHIPPAC PTE LTD2 citations72