Inventor

MISCHITZ MARTIN

AT22 patents

⚠️ This page may combine multiple inventors who share the name “MISCHITZ MARTIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MISCHITZ MARTIN

INFINEON TECHNOLOGIES AG

Method for processing a semiconductor substrate and a method for processing a semiconductor wafer

Device including a metallization layer and method of manufacturing a device

Method of manufacturing a layer structure having partially sealed pores

Method of manufacturing an electronic device having a contact pad with partially sealed pores

Method for manufacturing semiconductor devices

Method for producing a copper layer on a semiconductor body using a printing process

Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnect

Method for fabricating a semiconductor device comprising a paste layer and semiconductor device

Source down semiconductor devices and methods of formation thereof

Source down semiconductor devices and methods of formation thereof

Semiconductor device having a porous metal layer and an electronic device having the same

Integrated circuit substrate having configurable circuit elements

Integrated circuit substrate and method for manufacturing the same

Method of manufacturing an integrated circuit substrate

Method for structuring a substrate using a protection layer as a mask

Method for structuring a substrate

Integrated circuit substrate and method for manufacturing the same

Carrier system for processing semiconductor substrates, and methods thereof

INFINEON TECHNOLOGIES AUSTRIA AG

Method of depositing a resin material on a semiconductor body with an inkjet process

Method of processing a porous conductive structure in connection to an electronic component on a substrate

MOTZ MARIO

Current sensor including a sintered metal layer

INFINEON TECHNOLOGIES AUSTRIA

Inkjet printing in a peripheral region of a substrate