Inventor

OH SANGWON

KR4 patents

⚠️ This page may combine multiple inventors who share the name “OH SANGWON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOREA ELECTRONICS TELECOMM

2 patents

US9155236B2Oct 6, 2015

Composition and methods of forming solder bump and flip chip using the same

KOREA ELECTRONICS TELECOMM0 citations49

US8802760B2Aug 12, 2014

Composition and methods of forming solder bump and flip chip using the same

KOREA ELECTRONICS TELECOMM0 citations49

ELECTRONICS & TELECOMMUNICATIONS RES INST

1 patent

US9462736B2Oct 4, 2016

Composition and methods of forming solder bump and flip chip using the same

ELECTRONICS & TELECOMMUNICATIONS RES INST1 citations59

EOM YONG SUNG

1 patent

US8420722B2Apr 16, 2013

Composition and methods of forming solder bump and flip chip using the same

EOM YONG SUNG3 citations57