Inventor
VIJAYAKUMAR BHUVANESHWARAN
US6 patents
Patents
6 patentsUS10141901B2Nov 27, 2018
Flip-chip amplifier with termination circuit
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US9467940B2Oct 11, 2016
Flip-chip linear power amplifier with high power added efficiency
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US11974390B2Apr 30, 2024
Reduction of packaging substrate deformation
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US11596056B2Feb 28, 2023
Methods and devices related to reduced packaging substrate deformation
SKYWORKS SOLUTIONS INC2 citations72
US12593394B2Mar 31, 2026
Heat transfer from non-groundable electronic components
SKYWORKS SOLUTIONS INC0 citations61
US12520415B2Jan 6, 2026
Method of transferring heat from ungrounded electronic components
SKYWORKS SOLUTIONS INC0 citations61