Inventor
HOTTA TAKANOBU
JP17 patents
Patents
17 patentsUS9536782B2Jan 3, 2017
Tungsten film forming method, semiconductor device manufacturing method, and storage medium
TOKYO ELECTRON LTD9 citations83
US9640404B2May 2, 2017
Method of forming tungsten film
TOKYO ELECTRON LTD4 citations73
US12188125B2Jan 7, 2025
Showerhead and substrate processing apparatus
TOKYO ELECTRON LTD2 citations72
US10872814B2Dec 22, 2020
Film forming method and film forming apparatus
TOKYO ELECTRON LTD3 citations72
US10026616B2Jul 17, 2018
Method of reducing stress in metal film and metal film forming method
TOKYO ELECTRON LTD4 citations72
US9472454B2Oct 18, 2016
Tungsten film forming method
TOKYO ELECTRON LTD5 citations71
US9536745B2Jan 3, 2017
Tungsten film forming method
TOKYO ELECTRON LTD5 citations70
US12227843B2Feb 18, 2025
Film forming method and tungsten film
TOKYO ELECTRON LTD0 citations60
US12221693B2Feb 11, 2025
Stress reducing method
TOKYO ELECTRON LTD0 citations60
US11629404B2Apr 18, 2023
Method of forming tungsten film and controller
TOKYO ELECTRON LTD0 citations60
US10910225B2Feb 2, 2021
Film forming method
TOKYO ELECTRON LTD0 citations60
US10400330B2Sep 3, 2019
Tungsten film forming method and storage medium
TOKYO ELECTRON LTD1 citations59
US10131986B2Nov 20, 2018
Method of forming metal film
TOKYO ELECTRON LTD1 citations51
US9938620B2Apr 10, 2018
Gas supply mechanism, gas supplying method, film forming apparatus and film forming method using the same
TOKYO ELECTRON LTD1 citations51
US12584220B2Mar 24, 2026
Showerhead and substrate processing apparatus
TOKYO ELECTRON LTD0 citations50
US11984319B2May 14, 2024
Substrate processing method and film forming system
TOKYO ELECTRON LTD0 citations50
US11753719B2Sep 12, 2023
Flow rate control method, flow rate control device, and film forming apparatus
TOKYO ELECTRON LTD0 citations46