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Inventor
IWAMI HIROYUKI
JP
5 patents
⚠️ This page may combine multiple inventors who share the name “IWAMI HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MIDORI ELECTRONICS CO LTD
1 patent
US5159671A
Oct 27, 1992
Data transfer unit for small computer system with simultaneous transfer to two memories and error detection and rewrite to substitute address
MIDORI ELECTRONICS CO LTD
72 citations
92
OSAKA CITY & TAIYO MANUFACTURI
1 patent
US4225109A
Sep 30, 1980
Insulated metal mold
OSAKA CITY & TAIYO MANUFACTURI
68 citations
91
TAIYO KOSAKUSHO KK
1 patent
US5468141A
Nov 21, 1995
Mold for injection molding of thermoplastic resin
TAIYO KOSAKUSHO KK
58 citations
89
YOTSUTSUJI AKIRA
1 patent
US4285901A
Aug 25, 1981
Method of making an insulated metal mold
YOTSUTSUJI AKIRA
43 citations
87
IWAMI HIROYUKI
1 patent
US8865042B2
Oct 21, 2014
Mold for thermoplastic resin molding, cavity mold, and process for producing the cavity mold
IWAMI HIROYUKI
0 citations
32