Inventor

SHIU RUEI-JE

TW2 patents

Patents

2 patents

US6861376B1Mar 1, 2005

Photoresist scum free process for via first dual damascene process

TAIWAN SEMICONDUCTOR MFG17 citations79

US6489216B1Dec 3, 2002

Chemical mechanical polish (CMP) planarizing method employing topographic mark preservation

TAIWAN SEMICONDUCTOR MFG7 citations70