Inventor
YUZAWA TAKESHI
JP17 patents
⚠️ This page may combine multiple inventors who share the name “YUZAWA TAKESHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEIKO EPSON CORP
14 patentsUS8742601B2Jun 3, 2014
Semiconductor device including a buffer layer structure for reducing stress
SEIKO EPSON CORP10 citations92
US9842821B2Dec 12, 2017
Semiconductor device including semiconductor chip, wiring, conductive material, and contact part
SEIKO EPSON CORP3 citations83
US9515043B2Dec 6, 2016
Semiconductor device including a buffer layer structure for reducing stress
SEIKO EPSON CORP5 citations83
US9331039B2May 3, 2016
Semiconductor device including a buffer layer structure for reducing stress
SEIKO EPSON CORP6 citations83
US9093334B2Jul 28, 2015
Semiconductor device including a buffer layer structure for reducing stress
SEIKO EPSON CORP7 citations83
US8952554B2Feb 10, 2015
Semiconductor device including a buffer layer structure for reducing stress
SEIKO EPSON CORP8 citations83
US7230338B2Jun 12, 2007
Semiconductor device that improves electrical connection reliability
SEIKO EPSON CORP14 citations83
US7598612B2Oct 6, 2009
Semiconductor device and manufacturing method thereof
SEIKO EPSON CORP7 citations73
US10103120B2Oct 16, 2018
Semiconductor device including a buffer layer structure for reducing stress
SEIKO EPSON CORP1 citations62
US7560814B2Jul 14, 2009
Semiconductor device that improves electrical connection reliability
SEIKO EPSON CORP2 citations61
US7037758B2May 2, 2006
Semiconductor device, method of manufacturing the same, circuit board and electronic apparatus
SEIKO EPSON CORP6 citations60
US10658325B2May 19, 2020
Semiconductor device including a buffer layer structure for reducing stress
SEIKO EPSON CORP0 citations51
US7936064B2May 3, 2011
Semiconductor device
SEIKO EPSON CORP0 citations51
US7176581B2Feb 13, 2007
Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus
SEIKO EPSON CORP0 citations41
YUZAWA TAKESHI
3 patentsUS8614513B2Dec 24, 2013
Semiconductor device including a buffer layer structure for reducing stress
YUZAWA TAKESHI11 citations90
US8441125B2May 14, 2013
Semiconductor device
YUZAWA TAKESHI0 citations49
US8878365B2Nov 4, 2014
Semiconductor device having a conductive layer reliably formed under an electrode pad
YUZAWA TAKESHI0 citations39