Inventor

YOU JIN-WEI

TW4 patents

⚠️ This page may combine multiple inventors who share the name “YOU JIN-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION INDUSTRIES CO LTD

3 patents

US11143549B2Oct 12, 2021

Electronic packaging structure and method for manufacturing the electronic packaging structure with optical guide die separate from electronic package and photonic die

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations56

US10764995B2Sep 1, 2020

Fabrication method of substrate structure

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48

US9907161B2Feb 27, 2018

Substrate structure and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48

SILICONWAR E PR ECISION IND CO LT D

1 patent

US11443994B2Sep 13, 2022

Electronic package, electronic packaging module having the electronic package, and method for fabricating the electronic package

SILICONWAR E PR ECISION IND CO LT D0 citations38