Inventor

CHANG CHENG-KAI

TW9 patents

⚠️ This page may combine multiple inventors who share the name “CHANG CHENG-KAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION INDUSTRIES CO LTD

7 patents

US11398429B2Jul 26, 2022

Electronic package and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61

US11195812B2Dec 7, 2021

Method for fabricating an encapsulated electronic package using a supporting plate

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations60

US11143549B2Oct 12, 2021

Electronic packaging structure and method for manufacturing the electronic packaging structure with optical guide die separate from electronic package and photonic die

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations56

US12362263B2Jul 15, 2025

Electronic package and method of fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations53

US12002737B2Jun 4, 2024

Electronic package and method of fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations53

US11114412B2Sep 7, 2021

Electronic package and method for fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50

US10431535B2Oct 1, 2019

Electronic package and method for fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations46

IND TECH RES INST

1 patent

US6041322AMar 21, 2000

Method and apparatus for processing data in a neural network

IND TECH RES INST87 citations92

SILICONWAR E PR ECISION IND CO LT D

1 patent

US11443994B2Sep 13, 2022

Electronic package, electronic packaging module having the electronic package, and method for fabricating the electronic package

SILICONWAR E PR ECISION IND CO LT D0 citations38