Inventor
JENG JACOB
TW2 patents
Patents
2 patentsUS6133067AOct 17, 2000
Architecture for dual-chip integrated circuit package and method of manufacturing the same
AMIC TECHNOLOGY INC29 citations89
US6200828B1Mar 13, 2001
Integrated circuit package architecture with a variable dispensed compound and method of manufacturing the same
AMIC TECHNOLOGY INC18 citations81