Inventor
KIM HYEONGNO
KR5 patents
Patents
5 patentsUS6489218B1Dec 3, 2002
Singulation method used in leadless packaging process
ADVANCED SEMICONDUCTOR ENG150 citations96
US7087461B2Aug 8, 2006
Process and lead frame for making leadless semiconductor packages
ADVANCED SEMICONDUCTOR ENG71 citations94
US7576415B2Aug 18, 2009
EMI shielded semiconductor package
ADVANCED SEMICONDUCTOR ENG126 citations92
US7169651B2Jan 30, 2007
Process and lead frame for making leadless semiconductor packages
ADVANCED SEMICONDUCTOR ENG26 citations89
US7566962B2Jul 28, 2009
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations49