Inventor
ARAVAMUDHAN SRINIVASA
US3 patents
Patents
3 patentsUS12532412B2Jan 20, 2026
Metal organic frameworks (MOFS) filler for enabling low CTE and low dielectric constant PCB
INTEL CORP0 citations54
US11569596B2Jan 31, 2023
Pressure features to alter the shape of a socket
INTEL CORP0 citations53
US10505297B2Dec 10, 2019
Pin through solder interconnect and methods
INTEL CORP0 citations43