Inventor
HIDAKA KENICHI
JP25 patents
⚠️ This page may combine multiple inventors who share the name “HIDAKA KENICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
7 patentsUS6653697B2Nov 25, 2003
High frequency switch circuit and communications terminal using the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD80 citations98
US7106121B2Sep 12, 2006
High frequency switch circuit
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD46 citations92
US7337547B2Mar 4, 2008
High frequency switching circuit device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD12 citations83
US7020453B2Mar 28, 2006
High-frequency switch circuit and mobile telecommunications terminal device using the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD12 citations83
US7079860B1Jul 18, 2006
Semiconductor apparatus and communication apparatus
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8 citations73
US7425747B2Sep 16, 2008
Semiconductor device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations63
US7250642B2Jul 31, 2007
Field-effect transistor
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations62
NGK INSULATORS LTD
7 patentsUS10421213B2Sep 24, 2019
Ceramic formed body extrusion method, ceramic formed body, and ceramic porous body
NGK INSULATORS LTD2 citations71
US9289754B2Mar 22, 2016
Honeycomb structure
NGK INSULATORS LTD2 citations63
US11666890B2Jun 6, 2023
Porous ceramic structure
NGK INSULATORS LTD0 citations62
US9339799B2May 17, 2016
Honeycomb structure and manufacturing method thereof
NGK INSULATORS LTD2 citations60
US12390793B2Aug 19, 2025
Porous composite and method of producing porous composite
NGK INSULATORS LTD0 citations57
US10632648B2Apr 28, 2020
Ceramic formed body extrusion method, ceramic formed body, and ceramic porous body
NGK INSULATORS LTD0 citations51
US10596722B2Mar 24, 2020
Ceramic formed body extrusion method, ceramic formed body, and ceramic porous body
NGK INSULATORS LTD0 citations51
NEC ELECTRONICS CORP
3 patentsUS7626855B2Dec 1, 2009
Semiconductor memory device
NEC ELECTRONICS CORP4 citations62
US7838961B2Nov 23, 2010
Method of manufacturing semiconductor device
NEC ELECTRONICS CORP2 citations61
US7449393B2Nov 11, 2008
Method of manufacturing a semiconductor device with a shallow trench isolation structure
NEC ELECTRONICS CORP1 citations51