Inventor
CHUANG LIPU KRIS
TW18 patents
Patents
18 patentsUS10510713B1Dec 17, 2019
Semicondcutor package and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations92
US11450581B2Sep 20, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations85
US11749640B2Sep 5, 2023
Semiconductor package and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11205636B2Dec 21, 2021
Semiconductor package and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10811384B2Oct 20, 2020
Semiconductor package and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10720416B2Jul 21, 2020
Semiconductor package including thermal relaxation block and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11984372B2May 14, 2024
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12588549B2Mar 24, 2026
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12557681B2Feb 17, 2026
Semiconductor package and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12255196B2Mar 18, 2025
Semiconductor package with thermal relaxation block and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11830866B2Nov 28, 2023
Semiconductor package with thermal relaxation block and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11309302B2Apr 19, 2022
Manufacturing method of semiconductor package including thermal conductive block
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11018113B2May 25, 2021
Memory module, semiconductor package including the same, and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12400936B2Aug 26, 2025
Stacked memory cube with integrated thermal path for enhanced heat dissipation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11551999B2Jan 10, 2023
Memory device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10256203B2Apr 9, 2019
Semiconductor device and semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12438007B2Oct 7, 2025
Staggered metal mesh on backside of device die and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10672681B2Jun 2, 2020
Semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51