Inventor
LEE HUNG-PING
TW7 patents
⚠️ This page may combine multiple inventors who share the name “LEE HUNG-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
J METRICS TECH CO LTD
4 patentsUS11075072B2Jul 27, 2021
Wafer scale ultrasonic sensing device and manufacturing method thereof
J METRICS TECH CO LTD3 citations68
US11460341B2Oct 4, 2022
Wafer scale ultrasonic sensor assembly and method for manufacturing the same
J METRICS TECH CO LTD3 citations67
US11806751B2Nov 7, 2023
Wafer level ultrasonic device and manufacturing method thereof
J METRICS TECH CO LTD1 citations58
US11478822B2Oct 25, 2022
Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof
J METRICS TECH CO LTD0 citations47