P

Inventor

MUN SEON JAE

KR12 patents
⚠️ This page may combine multiple inventors who share the name “MUN SEON JAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

9 patents
US10770227B2Sep 8, 2020

Capacitor and board having the same

SAMSUNG ELECTRO MECH0 citations51
US8835302B2Sep 16, 2014

Method of fabricating a package substrate

SAMSUNG ELECTRO MECH0 citations51
US11049659B2Jun 29, 2021

Multilayer ceramic electronic component and method for manufacturing the same

SAMSUNG ELECTRO MECH0 citations50
US12051543B2Jul 30, 2024

Mutilayer electronic component and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations49
US11996244B2May 28, 2024

Multilayer electronic component and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations49
US11990284B2May 21, 2024

Multilayered electronic component

SAMSUNG ELECTRO MECH0 citations49
US12002623B2Jun 4, 2024

Multilayered electronic component

SAMSUNG ELECTRO MECH0 citations48
US12002628B2Jun 4, 2024

Multilayered electronic component and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations48
US12002627B2Jun 4, 2024

Multilayer electronic component and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations48

OH HUENG JAE

1 patent
US8671564B2Mar 18, 2014

Substrate for flip chip bonding and method of fabricating the same

OH HUENG JAE3 citations56

CHUNG TAE JOON

1 patent
US8486760B2Jul 16, 2013

Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same

CHUNG TAE JOON2 citations56

LEE DONG GYU

1 patent
US8456003B2Jun 4, 2013

Package substrate capable of controlling the degree of warpage

LEE DONG GYU1 citations50