Inventor
TU WU-CHANG
TW11 patents
⚠️ This page may combine multiple inventors who share the name “TU WU-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPMOS TECHNOLOGIES INC
7 patentsUS7615853B2Nov 10, 2009
Chip-stacked package structure having leadframe with multi-piece bus bar
CHIPMOS TECHNOLOGIES INC21 citations92
US7816771B2Oct 19, 2010
Stacked chip package structure with leadframe having inner leads with transfer pad
CHIPMOS TECHNOLOGIES INC14 citations83
US7786595B2Aug 31, 2010
Stacked chip package structure with leadframe having bus bar
CHIPMOS TECHNOLOGIES INC7 citations73
US7576416B2Aug 18, 2009
Chip package having with asymmetric molding and turbulent plate downset design
CHIPMOS TECHNOLOGIES INC7 citations73
US7834432B2Nov 16, 2010
Chip package having asymmetric molding
CHIPMOS TECHNOLOGIES INC0 citations51
US8026615B2Sep 27, 2011
IC package reducing wiring layers on substrate and its carrier
CHIPMOS TECHNOLOGIES INC0 citations50
US7781898B2Aug 24, 2010
IC package reducing wiring layers on substrate and its chip carrier
CHIPMOS TECHNOLOGIES INC0 citations50
SHEN GENG-SHIN
3 patentsUS8212347B2Jul 3, 2012
Stacked chip package structure with leadframe having bus bar
SHEN GENG-SHIN1 citations61
US8207603B2Jun 26, 2012
Stacked chip package structure with leadframe having inner leads with transfer pad
SHEN GENG-SHIN1 citations50
US8169061B2May 1, 2012
Stacked chip package structure with leadframe having bus bar
SHEN GENG-SHIN1 citations50