Inventor
TAKASAKI HAJIME
JP4 patents
⚠️ This page may combine multiple inventors who share the name “TAKASAKI HAJIME”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KAGAYA YUTAKA
2 patentsUS8076770B2Dec 13, 2011
Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion
KAGAYA YUTAKA72 citations94
US8710647B2Apr 29, 2014
Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board
KAGAYA YUTAKA0 citations49