Inventor
NAGASAWA TADASHI
JP10 patents
⚠️ This page may combine multiple inventors who share the name “NAGASAWA TADASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KYOCERA CORP
7 patentsUS6663946B2Dec 16, 2003
Multi-layer wiring substrate
KYOCERA CORP69 citations93
US11426970B2Aug 30, 2022
Laminated uncured sheet
KYOCERA CORP0 citations58
US12408268B2Sep 2, 2025
Organic insulator and wiring board
KYOCERA CORP0 citations55
US10806031B2Oct 13, 2020
Organic insulating body, metal-clad laminate and wiring board
KYOCERA CORP0 citations49
US12177971B2Dec 24, 2024
Wiring board
KYOCERA CORP0 citations46
US10772198B2Sep 8, 2020
Organic insulator, metal-clad laminate and wiring board
KYOCERA CORP0 citations46
US9693451B2Jun 27, 2017
Wiring board, mounting structure using same, and method of manufacturing wiring board
KYOCERA CORP0 citations40
NAGASAWA TADASHI
3 patentsUS8129623B2Mar 6, 2012
Resin film, adhesive sheet, circuit board, and electronic apparatus
NAGASAWA TADASHI7 citations81
US8431832B2Apr 30, 2013
Circuit board, mounting structure, and method for manufacturing circuit board
NAGASAWA TADASHI4 citations59
US8338717B2Dec 25, 2012
Circuit substrate and structure using the same
NAGASAWA TADASHI0 citations37