Inventor

LIN YI-TZENG

TW3 patents

Patents

3 patents

US11869846B1Jan 9, 2024

Interposer routing structure and semiconductor package

GLOBAL UNICHIP CORP2 citations66

US11869845B2Jan 9, 2024

Semiconductor package device and semiconductor wiring substrate thereof

GLOBAL UNICHIP CORP0 citations55

US12506057B2Dec 23, 2025

Interposer device and semiconductor package structure

GLOBAL UNICHIP CORP0 citations43