Inventor

SHIMIZU NOBUTAKA

JP27 patents

⚠️ This page may combine multiple inventors who share the name “SHIMIZU NOBUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIMIZU NOBUTAKA

FUJITSU LTD

Ceramic package type semiconductor device and method of assembling the same

Semiconductor device and manufacturing method thereof

Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board

Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board

Flip-chip semiconductor device having an improved reliability

Semiconductor device having cap

Ceramic package type semiconductor device and method of assembling the same

SHIMIZU NOBUTAKA

Panel

Plate

Home medical apparatus

Plate

Plate

Plate

SOCIONEXT INC

Semiconductor device, manufacturing method thereof, and electronic apparatus

Semiconductor device having multiple bonded heat sinks

Semiconductor device and manufacturing method of semiconductor device

TERUMO CORP

Infusion pump

Infusion pump

NIPPON STEEL & SUMITOMO METAL CORP

Panel having recesses and protrusions

Deformation mode analysis method for member of structure, structure reinforcement method using deformation mode analysis method, computer program for deformation mode analysis of structure, and recording medium

FUJITSU SEMICONDUCTOR LTD

Method for manufacturing a semiconductor device having multiple heat sinks

Semiconductor device and manufacturing method thereof

SANDEN CORP

Heat medium temperature adjustment system

Vehicle air conditioning apparatus

SANDEN HOLDINGS CORP

Heat pump system for vehicle air conditioning devices

NIPPON STEEL CORP

Exterior panel and manufacturing method of exterior panel

NIWA TOSHIYUKI

Front body structure