Inventor
GAN CHONG LEONG
TW6 patents
Patents
6 patentsUS12532775B2Jan 20, 2026
Methods and assemblies for measurement and prediction of package and die strength
MICRON TECHNOLOGY INC0 citations60
US12218103B2Feb 4, 2025
Radiation hardened semiconductor devices and packaging
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US12557679B2Feb 17, 2026
Methods and apparatus for using epoxy-based or ink-based spacer to support large die in semiconductor devices
MICRON TECHNOLOGY INC0 citations53
US12424565B2Sep 23, 2025
Radiation protection for semiconductor devices and associated systems and methods
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US11515222B2Nov 29, 2022
Semiconductor assemblies with flow controller to mitigate ingression of mold material
MICRON TECHNOLOGY INC0 citations50
US12582014B2Mar 17, 2026
Semiconductor device assembly substrates with tunneled interconnects, and methods for making the same
MICRON TECHNOLOGY INC0 citations44