Inventor

LEHNERT WOLFGANG

DE41 patents

⚠️ This page may combine multiple inventors who share the name “LEHNERT WOLFGANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEHNERT WOLFGANG

INFINEON TECHNOLOGIES AG

Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor device

Method for forming a semiconductor device and a semiconductor device

Method for forming a semiconductor device and a semiconductor device

Method for forming a wafer structure, a method for forming a semiconductor device and a wafer structure

Two-dimensional material containing electronic components

Compound structure and method for forming a compound structure

Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers

Semiconductor devices and processing methods

Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core

Method for providing a self-aligned pad protection in a semiconductor device

Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate

Power semiconductor device and method of producing a power semiconductor device

Wafer composite and method for producing a semiconductor component

Wafer composite and method for producing semiconductor components

Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device

Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers

Methods for processing a semiconductor substrate

Semiconductor device

Chip package and method of forming a chip package

Chip package and method of forming a chip package

Method for manufacturing a composite wafer having a graphite core

Method of manufacturing a semiconductor package, die, and die package

Method of manufacturing a template wafer

Capacitor and method of forming a capacitor

Capacitor having a top compressive polycrystalline plate

Method for providing a self-aligned pad protection in a semiconductor device

Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core

Capacitor and method of forming a capacitor

Compressive polycrystalline silicon film and method of manufacture thereof

Composite wafer for bonding and encapsulating an SiC-based functional layer

Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package

BERGER RUDOLF

Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core

Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core

LEHNERT WOLFGANG

Compressive polycrystalline silicon film and method of manufacture thereof

Method of forming a capacitor

INFINEON TECHNOLOGIES AUSTRIA

Method for producing a semiconductor including a foreign material layer

Method for forming a power semiconductor device

MAUDER ANTON

Power semiconductor device and a method for forming a semiconductor device

INFINEON TECHNOLOGIES AUSTRIA AG

Method of manufacturing semiconductor devices by bonding a semiconductor disk on a base substrate, composite wafer and semiconductor device

TELAIR INT GMBH

Fastening device for releasable connection to a perforated rail of an aircraft and method of assembly

AHRENS CARSTEN

Method for producing a semiconductor device