Inventor
MAKI SHINJI
JP12 patents
Patents
12 patentsUS7857190B2Dec 28, 2010
Wire bonding apparatus, record medium storing bonding control program, and bonding method
SHINKAWA KK67 citations97
US5988481ANov 23, 1999
Bonding apparatus with adjustable heating blocks, clamps, and rails
SHINKAWA KK21 citations92
US5562396AOct 8, 1996
Non-contact type moving table
SHINKAWA KK32 citations92
US5439341AAug 8, 1995
Non-contact type moving table
SHINKAWA KK23 citations92
US7686204B2Mar 30, 2010
Wire bonding apparatus, record medium storing bonding control program, and bonding method
SHINKAWA KK13 citations83
US6542783B2Apr 1, 2003
Tool position measurement method, offset measurement method, reference member and bonding apparatus
SHINKAWA KK9 citations73
US6145651ANov 14, 2000
Guide rail mechanism for a bonding apparatus
SHINKAWA KK9 citations73
US6135270AOct 24, 2000
Guide rail mechanism for a bonding apparatus
SHINKAWA KK9 citations73
US5564616AOct 15, 1996
Wire bonding apparatus
SHINKAWA KK8 citations73
US5562395AOct 8, 1996
Non-contact type moving table
SHINKAWA KK10 citations73
US5501569AMar 26, 1996
Non-contact type moving table
SHINKAWA KK7 citations73
US5431527AJul 11, 1995
Non-contact type moving table system
SHINKAWA KK8 citations73