Inventor

HSU LEE-WEN

TW2 patents

Patents

2 patents

US12543545B2Feb 3, 2026

Redistribution layer and methods of fabrication thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations54

US12399210B2Aug 26, 2025

Wafer test pad

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations54